https://doi.org/10.1140/epjp/s13360-025-06637-x
Regular Article
Embedded microneedle fin chip heat dissipation design and simulation
School of Mechatronic Engineering, Jiangsu Normal University, 221116, Xuzhou, China
a
hezz82@163.com
b
lxnam89@163.com
Received:
22
April
2025
Accepted:
7
July
2025
Published online:
22
July
2025
Heat dissipation has become a critical challenge as chip power density and integration levels increase. Because of their superior heat transfer efficiency, embedded microneedle fins are fabricated on the backside of the die for thermal dissipation of high-power chips. A model of the chip with embedded microneedle fins was constructed and the cooling system was simulated in this paper. We investigated the effects of fluid-to-chip area ratio (30–90%), fin diameter (60–480 μm), and fin spacing (200–500 μm) on the thermo-hydraulic performance of such structures. Simulation results reveal that the maximum chip temperature dropped significantly by increasing the area ratio from 30 to 90%. The optimal performance was achieved through the coordinated adjustment of fin diameter and spacing, minimizing the thermal resistance while reducing the fluid pressure drop. Further analysis based on Reynolds number confirms the consistent trends between heat transfer enhancement and hydraulic losses. Thus, the designed microneedle fin structure is effective to enhance the thermal dissipation, which is beneficial to the high-power electronic devices.
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© The Author(s), under exclusive licence to Società Italiana di Fisica and Springer-Verlag GmbH Germany, part of Springer Nature 2025
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
