https://doi.org/10.1140/epjp/s13360-024-05641-x
Regular Article
Topological analysis of entropy measure using regression model for silicon carbide network
1
Department of Science and Humanities, PES University, Bangalore, India
2
Department of Mathematics, COMSATS University Islamabad, Lahore Campus, Lahore, Pakistan
Received:
8
March
2024
Accepted:
10
September
2024
Published online:
23
September
2024
A topological index, a numerical parameter, is used to represent the molecular structure of a compound by analyzing its graph-theoretical properties. In quantitative structure–activity relationship (QSAR) and quantitative structure–property relationship (QSPR) studies, topological indices are used as predictive tools for determining the physicochemical properties of chemical compounds, and graph entropies have become information-theoretic tools for analyzing the structural information of molecular graphs. In this study, we calculate the Nirmala index, along with the first and second inverse Nirmala indices, for the silicon carbide network ![$$\text {Si}_{2}\text {C}_{3}\text {-II}[\phi , \psi ]$$](/articles/epjplus/abs/2024/09/13360_2024_Article_5641/13360_2024_Article_5641_tex_eq1.png)
using its M-polynomial. Additionally, entropy measures based on Nirmala indices are derived for the aforementioned network using Shannon’s entropy model. The comparison of the Nirmala indices with their corresponding entropy measures is conducted through numerical computations and 2D line plots. The correlation between the Nirmala indices and the associated entropy measures is then analyzed using a logarithmic regression model.
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© The Author(s), under exclusive licence to Società Italiana di Fisica and Springer-Verlag GmbH Germany, part of Springer Nature 2024. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
