https://doi.org/10.1140/epjp/s13360-024-05155-6
Regular Article
Regularity of thermal characteristics, thermoelectric properties of EuLnCuSe3 compounds (Ln = La–Lu)
1
Department of Inorganic and Physical Chemistry, University of Tyumen, 625003, Tyumen, Russia
2
Thermoelement Physics Laboratory, Department of Physics of Dielectrics and Semiconductors, Ioffe Institute, 194021, St. Petersburg, Russia
3
Department of Physical and Applied Chemistry, Kurgan State University, Sovetskaya Str. 63/4, 640020, Kurgan, Russia
4
Kirensky Institute of Physics, Federal Research Center KSC SB RAS, Akademgorodok Str. 50, Building 38, 660036, Krasnoyarsk, Russia
5
Siberian Federal University, Svobodnyj Av. 79, 660079, Krasnoyarsk, Russia
6
School of Natural Sciences, University of Tyumen, 625003, Tyumen, Russia
7
Laboratory of the Chemistry of Rare Earth Compounds, Institute of Solid State Chemistry, UB RAS, 620990, Ekaterinburg, Russia
8
Department of Construction Materials, Industrial University of Tyumen, 625000, Tyumen, Russia
Received:
24
October
2023
Accepted:
3
April
2024
Published online:
15
May
2024
The temperatures and enthalpies of the decomposition of EuLnCuSe3 compounds (Ln = La–Lu) are determined for the first time as functions of the Ln3+ ionic radius (rLn3+). The EuLnCuSe3 compounds with Ln = La and Ce decompose in the course of a solid-phase reaction to form EuSe, Ln2Se3, and Cu2−xSe, whereas those with Ln = Tb, Dy, Ho, Tm, and Lu melt incongruently to form EuSe and a melt, for example, Tdecay = 1175 K and ΔHdecay = 2.66 kJ/mol for EuLaCuSe3, while Tmelt = 1576 K and ΔHmelt = 2.69 kJ/mol for EuTbCuSe3. When plotted as functions of rLn3+, the temperatures of thermal effects of these compounds exhibit a periodic dependence and a tetrad effect. The temperature dependence of electrical resistivity and that of the Seebeck coefficient are measured from 300 to 600 K. It is shown that the studied compounds are p-type semiconductors with bandgaps ranging from 0.4 to ~ 1 eV.
Supplementary Information The online version contains supplementary material available at https://doi.org/10.1140/epjp/s13360-024-05155-6.
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